Pubblicazione scientifica

Bending machine for testing reliability of flexible electronics

FILONE TECNOLOGICO	TEMA
produzione e cattura

RIASSUNTO

A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowing reliability prediction models to be developed. Four sets of test samples with different combinations of substrate, routing, interconnect technology and components were examined. A poor level of reliability was observed when using anisotropic conductive paste to form interconnects, whereas a significantly higher level of reliability was observed when using a bismuth-tin solder paste. The assembly of larger components resulted in shortened time to failure, whereas increasing the bending radius prolonged the observed lifetimes.

DATA

Data di pubblicazione: 01/06/2017

AUTORI

DANIEL NILSEN WRIGHT
ASTRID-SOFIE B VARDOY
BRANSON D BELLE
MAAIKE M VISSER TAKLO
OLLE HAGEL
LI XIE
MAGNUS DANESTIG
TORBJORN ERIKSSON

ENTE DI AFFERENZA

SMART SENSOR SYS SINTEF DIGITAL FORSKNINGSVEIEN 1 0373 OSLO NORWAY
THINFILM ELTNC ASA

RIVISTA

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (Page(s): 47-52)

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